Advanced HDI PCB Stackup & Microvia Technology
Figure 1: High-precision UV/CO2 laser drilling systems in JS Circuit’s class-1000 cleanroom Executive Summary As medical diagnostics and wearables shrink, traditional through-hole vias become major bottlenecks for signal routing and routing density. High-Density Interconnect (HDI) technology solves this via sequential lamination and laser-drilled microvias. This whitepaper analyzes the mechanical limits, plating physics, and thermal reliability […]
Fundamentals of PCB Stackup Design for High-Reliability Medical Electronics
Figure 1: Engineered symmetry in an 8-layer medical PCB stackup to prevent thermal warpage. Executive Summary In high-precision medical electronics, the PCB stackup design is much more than a simple arrangement of layers; it is a critical component of the circuit’s electrical performance. This article explores the fundamental engineering behind layer sequencing, material physics (Dk […]
