Rigid-Flex Capabilities
| Material | FCCL (adhesive) | Shengyi SF302: PI=0.5mil, 1mil, 2mil; Cu=0.5oz, 1oz |
| FCCL (adhesiveless) | Shengyi SF056: PI=0.5mil, 1mil, 2mil; Cu=0.3oz, 0.5oz, 1oz | |
| FCCL (adhesiveless) | Panasonic R-F775: PI=1mil, 2mil, 3mil; Cu=0.5oz, 1oz, 2oz | |
| FCCL (adhesiveless) | Dupont AP: PI=1mil, 2mil, 3mil, 4mil; Cu=0.3oz/0.5oz/1oz/2oz | |
| Coverlay | Shengyi SF302C: 0.5/5, 0.5/25, 1/0.5, 20/30 | |
| Coverlay | Taiflex FHK: 10/25, 10/35 | |
| Adhesive | Taiflex: AD=10um, 25um, 40um | |
| PI Stiffener | Shengyi SF302B: AD=25um, 40um | |
| PI Stiffener | Taiflex MHK: PI=2mil, 3mil, 5mil, 7mil | |
| Others | Design software | CAM350, PROTEL, PADs, POWERPCB, AUTOCAD, GENESIS, ORCAD |
| Gerber format | RS-274-D, RS-274-X | |
| Drill format | EXCELLON | |
| Layer count | 2–26 | |
| Board thickness | 0.3–4.0mm | |
| Board thickness tolerance (t ≤ 1.0mm) | ±10% | |
| Board thickness tolerance (t ≥ 1.0mm) | ±10% | |
| Min board size | 10mm × 15mm | |
| Max board size | 400mm × 750mm | |
| Impedance tolerance | ±10% (50Ω), ±8% (≤ 50Ω) | |
| HDI | 1+N+1, 2+N+2 | |
| Warpage (%) | 0.7% | |
| Width of strain relief | 1.2 ± 0.5mm | |
| Min/Max impedance | 100Ω | |
| Max test impedance | 100MΩ | |
| Max test current | 200mA | |
| Max test voltage | 500V | |
| Inner layer | Min. line width/spacing (1/2oz copper) | 3mil |
| Min. line width/spacing (1oz copper) | 3.5mil | |
| Min. line width/spacing (2oz copper) | 5.0mil | |
| Max. copper thickness | 3oz | |
| Min distance avoid copper exposure | 8mil | |
| Drill | Min metal hole | 0.3mm |
| Max aspect ratio | 12:01 | |
| Min distance between PTH and conductors | 5mil (≤ 5 layers) | |
| Min distance between PTH and conductors | 7mil (6–11 layers) | |
| Min distance between PTH and conductors | 10mil (12–18 layers) | |
| Laser blind hole | 4–6mil | |
| Outer layer | Min. line width/spacing (1/2oz copper) | 3.2mil |
| Min. line width/spacing (1oz copper) | 3.5mil | |
| Min. line width/spacing (2oz copper) | 4.0mil | |
| Min. line width/spacing (3oz copper) | 6.0mil | |
| Min. line width/spacing (10um copper) | 9.0mil | |
| Max. copper thickness | 5oz | |
| Min distance avoid copper exposure | 8mil | |
| Solder mask / Silk screen | Min solder dam (base copper + 2oz) | 4mil (green), 6mil (solder dam on large copper) |
| Min solder dam (base copper + 2.0oz – 4.0oz) | 6mil (green), 8mil (on large copper) | |
| Min legend space and height (12–18um copper) | 4/25mil | |
| Min legend space and height (35um copper) | 5/30mil | |
| Min legend space and height (40um copper) | 5/30mil | |
| Min legend space and height (70um copper) | 6/35mil | |
| Min distance between legend and pad | 6mil | |
| Silk color | White, Yellow, Black | |
| Min tolerance of NPTH | ±2mil (d≤0.2), ±2mil or ±2mil_(d) | |
| Surface treatment | OSP | 0.1–0.3μm |
| Electrolytic Nickel Gold | 0.1–0.4μm | |
| Gold thickness (ENEPIG) | 0.05–0.10μm | |
| Nickel thickness (ENEPIG) | 3–8μm | |
| Palladium thickness (ENEPIG) | 0.05–0.15μm | |
| Gold thickness (Electrolytic Copper Gold Nickel) | 0.05–0.10μm | |
| Nickel thickness (Electrolytic Copper Gold Nickel) | 2–3μm | |
| Routing | Laser accuracy | ±0.05mm |
| Punch accuracy | ±0.10mm |
Frequently Asked Questions
What manufacturing capabilities does your facility support?
We support full-process PCB and FPC manufacturing from prototyping to mass production, including multilayer boards (2–26 layers), HDI stack-ups (1+N+1 / 2+N+2), impedance-controlled circuits, high-temperature laminates, and ultra-fine line processing. Our equipment covers laser drilling, AOI, E-test, CNC routing, and automated surface-treatment lines to ensure efficient and stable output.
What is your minimum line width and spacing capability?
For inner layers, we achieve 3mil/3mil line width and spacing on 1/2 oz copper, and 5mil capability on 2 oz copper.
For outer layers, we support 3.2mil/3.2mil (1/2 oz) and up to 9mil for heavy-copper designs.
All fine circuits are verified using AOI and impedance tools to ensure stable production.
What drilling and via capabilities do you offer?
We provide mechanical drilling down to 0.3 mm, laser blind vias of 4–6 mil, and aspect ratio up to 12:1. Our multilayer capability supports stacked/microvias, buried vias, and staggered via structures suitable for HDI and mobile devices.
Do you support controlled impedance designs?
Yes. We offer ±10% impedance tolerance for standard 50Ω lines and ±8% for high-precision applications. Our engineering team reviews stack-ups, dielectric data, and copper roughness to ensure accurate signal performance in high-speed circuits.
What surface finishing options are available?
We provide multiple finishes including OSP, ENIG, ENEPIG, Electrolytic Nickel-Gold, and selective gold. Gold thickness ranges from 0.05–0.10 μm, and nickel thickness from 3–8 μm, suitable for wire bonding, high-frequency circuits, and long-term reliability.
How do you ensure product quality and consistency?
Every job undergoes strict IQC–IPQC–FQC–OQC inspection, including dielectric testing, solderability checks, flying-probe testing, impedance measurement, and automated optical inspection.
We are equipped with laser measurement tools that verify routing accuracy to ±0.05 mm.
What is your maximum board size and panel capability?
We can produce single boards up to 400 mm × 750 mm, and flexible circuits sized for mobile, automotive, medical, and IoT applications. Minimum workable size is 10 mm × 15 mm, suitable for compact modules.
Hello! I am JS Circuit
Newsletter
In medical electronics, reliability isn’t a feature
— This is the baseline.
