Advanced HDI PCB Stackup & Microvia Technology
Figure 1: High-precision UV/CO2 laser drilling systems in JS Circuit’s class-1000 cleanroom Executive Summary As medical diagnostics and wearables shrink, traditional through-hole vias become major bottlenecks for signal routing and routing density. High-Density Interconnect (HDI) technology solves this via sequential lamination and laser-drilled microvias. This whitepaper analyzes the mechanical limits, plating physics, and thermal reliability […]
