Equipment List
Department | Process | Equipment |
Pre-Production | Planning | Frontline InPlan Planning Software |
CAM | Orbotech InCAM Pro v3.0SP4 | |
Photo Plotters | PR212-NT EIE photo plotter | |
Inner Layer | l/L Wet Film Coater | GRC-7N Automatic Wet Film Coater |
l/L Exposure | Various manual and semi-auto exposure | |
DES | Universal DES( Develop-Etch-Strip) Lines | |
AOI | Orbotech Discovery, Camtek | |
Alternative Oxide | Universal Alternative Oxide Line | |
Lamination Press | Burkle, OEM, Heng-da Vacumm Presses | |
Drilling | Mechanical Drill | Hitachi, Schmoll, HanHitachi,Mitsubishi |
Laser Drill | Hitachi LC-2G212E/2C Laser Drill | |
Outer Layer | Plasma Clean | ReBorn RPP-V13 |
PTH | Automatic Desmear and Electroless Copper | |
O/L Exposure | 5KW Manual Exposure | |
LDI(l/L&O/L) | Orbetech Paragon SM20 Laser Direct Imaging photeck | |
Copper Plating | Automatic Panel Plating Line | |
SES | Universal SES( Strip-Etch-Tin Strip) Line | |
Solder Mask and Silkscreen | Solder Mask Coater | Horizontal Semi Automatic Coater |
Exposure | Various SM Exposure ORC DI,orbotech diamond8 | |
Legend Printer | Orbotech Sprint 100 | |
Fabrication | Rout | CNC Routers |
V-Score | CNC V-score | |
Punch | Hydraulic Punch | |
Surface Finish | HASL | Tin/Lead HASL |
Lead Free HASL | Lead Free HASL | |
ENIG | Uyemura | |
ENEPIG | Uyemura | |
Immersion Silver | MacDermid(Planar), Sub-contract | |
Immersion Tin Line | Atotech(Stannatech) | |
OSP | Shikoku(Glicoat-SMD F2) | |
Hard Gold | Full body gold, gold fingers and selective gold | |
soft Gold Flash | Full body and selevtive bondable soft gold | |
Test and QC | E-Tester | Fxiture Systems |
Flying Probe | Flying Probe Test | |
Reliability Testing | X-section and Microscopes, Impendence Test, High-Pot, |
Frequently Asked Questions
What manufacturing capabilities does your facility support?
We support full-process PCB and FPC manufacturing from prototyping to mass production, including multilayer boards (2–26 layers), HDI stack-ups (1+N+1 / 2+N+2), impedance-controlled circuits, high-temperature laminates, and ultra-fine line processing. Our equipment covers laser drilling, AOI, E-test, CNC routing, and automated surface-treatment lines to ensure efficient and stable output.
What is your minimum line width and spacing capability?
For inner layers, we achieve 3mil/3mil line width and spacing on 1/2 oz copper, and 5mil capability on 2 oz copper.
For outer layers, we support 3.2mil/3.2mil (1/2 oz) and up to 9mil for heavy-copper designs.
All fine circuits are verified using AOI and impedance tools to ensure stable production.
What drilling and via capabilities do you offer?
We provide mechanical drilling down to 0.3 mm, laser blind vias of 4–6 mil, and aspect ratio up to 12:1. Our multilayer capability supports stacked/microvias, buried vias, and staggered via structures suitable for HDI and mobile devices.
Do you support controlled impedance designs?
Yes. We offer ±10% impedance tolerance for standard 50Ω lines and ±8% for high-precision applications. Our engineering team reviews stack-ups, dielectric data, and copper roughness to ensure accurate signal performance in high-speed circuits.
What surface finishing options are available?
We provide multiple finishes including OSP, ENIG, ENEPIG, Electrolytic Nickel-Gold, and selective gold. Gold thickness ranges from 0.05–0.10 μm, and nickel thickness from 3–8 μm, suitable for wire bonding, high-frequency circuits, and long-term reliability.
How do you ensure product quality and consistency?
Every job undergoes strict IQC–IPQC–FQC–OQC inspection, including dielectric testing, solderability checks, flying-probe testing, impedance measurement, and automated optical inspection.
We are equipped with laser measurement tools that verify routing accuracy to ±0.05 mm.
What is your maximum board size and panel capability?
We can produce single boards up to 400 mm × 750 mm, and flexible circuits sized for mobile, automotive, medical, and IoT applications. Minimum workable size is 10 mm × 15 mm, suitable for compact modules.
Hello! I am JS Circuit
Newsletter
In medical electronics, reliability isn’t a feature
— This is the baseline.
