PCBA Capabilities
| PCB Assembly Capabilities | |||
| Item | Fabrication Capabilities | ||
| The assembly number of layers | 1–48 layers | ||
| Assembly PCB board type | Rigid PCB (FR-4, Metal Core PCB), Flexible PCB (FPC), Rigid-Flex PCB, Aluminum PCB | ||
| Maximum Assembly PCB Size | 400 mm × 1200 mm (min 50 mm × 50 mm) | ||
| Component size | ±01005 (0.4 mm × 0.2 mm), 0201 | ||
| BGA and other high-precision ICs: we can detect BGA components with a Min 0.25 mm pitch through X-ray | |||
| Board Thickness | 0.3 mm – 4.5 mm | ||
| The whole placement accuracy | 0.0375 mm | ||
| Component packaging | Cut tape, Partial reel, Reel, Tube, Tray, Stainless steel | ||
| Production capacity | SMT chip 4 million points/day | ||
| Post-plug soldering 500,000 points/day | |||
| 50–100 models/day | |||
| PCBA soldering type | SMT, THT, Double-sided Assembly | ||
| Stencil | Using laser stencil to ensure small-pitch IC and BGA components assembly to meet IPC-2 Class or higher standards | ||
| False positive rate | ≤ 0.1% | ||
| Temperature accuracy | ± 1°C | ||
| Printing accuracy | ± 25 μm | ||
| X-Y axis accuracy | 0.5 μm | ||
| MOQ | 5 pcs | ||
| Component services | Full set of substitute materials, OEM only, Partial substitute materials | ||
| File Type | Bill of Materials/Components (BOM), PCB (Gerber files and most PCB design format files), Coordinate files | ||
| Test items | IQC, IPQC, Visual QC, SPI inspection, AOI, X-Ray, Functional test | ||
| Repair & Rework | BGA Rework Service | ||
| PCBA Material | |||
| Item | Characteristic | ||
| Brand | AEM, AVX, Coilcraft, VISHAY, FUJITSU, Yageo, Kyocera, muRata, Panasonic, Rubycon, TDK, TK, | ||
| TAIYO, ROHM, UniOhm, SAMSUNG, Fenghua, ONSEMI, TI, DIODES, FAILCHILD, NXP, ST, Infineon… | |||
| Material Grade | Commercial grade, Industrial grade, Automotive grade, Military grade, Aerospace grade | ||
| Components Type | Resistors, Capacitors, Inductors, ICs, Relays, Transistors, Connectors, FETs, Transformers | ||
| Grade Temperature | 0°C – +70°C, –40°C – +85°C, –40°C – +125°C, –55°C – +150°C | ||
| Halogen Free | Yes (optional) | ||
| ROHS | Yes | ||
| Packing method | Vacuum / Bubble bag / Pearl cotton | ||
| PCBA Prototype Lead Time | |||
| Prototype (< 3 m²) | Layer counts | Normal delivery | Urgent orders |
| PCBA (Components in stock) | 1 layer | 3 Days | 24 hours |
| 2 layers | 3 Days | 24 hours | |
| 4 layers | 3 Days | 24 hours | |
| 6 layers | 3 Days | 24 hours | |
| 8 layers | 4 Days | 3 Days | |
| 10 layers | 5 Days | 4 Days | |
| Above 10 layers | 6 Days | 5 Days | |
| PCBA Mass Production Lead Time | |||
| Mass production | Layer counts | Normal delivery | Urgent orders |
| PCBA (Components in stock) | 1 layer | 5 Days | 3 Days |
| 2 layers | 5 Days | 3 Days | |
| 4 layers | 6 Days | 5 Days | |
| 6 layers | 6 Days | 5 Days | |
| 8 layers | 7 Days | 6 Days | |
| 10 layers | 7 Days | 6 Days | |
| Above 10 layers | 9 Days | 7 Days | |
Frequently Asked Questions
What manufacturing capabilities does your facility support?
We support full-process PCB and FPC manufacturing from prototyping to mass production, including multilayer boards (2–26 layers), HDI stack-ups (1+N+1 / 2+N+2), impedance-controlled circuits, high-temperature laminates, and ultra-fine line processing. Our equipment covers laser drilling, AOI, E-test, CNC routing, and automated surface-treatment lines to ensure efficient and stable output.
What is your minimum line width and spacing capability?
For inner layers, we achieve 3mil/3mil line width and spacing on 1/2 oz copper, and 5mil capability on 2 oz copper.
For outer layers, we support 3.2mil/3.2mil (1/2 oz) and up to 9mil for heavy-copper designs.
All fine circuits are verified using AOI and impedance tools to ensure stable production.
What drilling and via capabilities do you offer?
We provide mechanical drilling down to 0.3 mm, laser blind vias of 4–6 mil, and aspect ratio up to 12:1. Our multilayer capability supports stacked/microvias, buried vias, and staggered via structures suitable for HDI and mobile devices.
Do you support controlled impedance designs?
Yes. We offer ±10% impedance tolerance for standard 50Ω lines and ±8% for high-precision applications. Our engineering team reviews stack-ups, dielectric data, and copper roughness to ensure accurate signal performance in high-speed circuits.
What surface finishing options are available?
We provide multiple finishes including OSP, ENIG, ENEPIG, Electrolytic Nickel-Gold, and selective gold. Gold thickness ranges from 0.05–0.10 μm, and nickel thickness from 3–8 μm, suitable for wire bonding, high-frequency circuits, and long-term reliability.
How do you ensure product quality and consistency?
Every job undergoes strict IQC–IPQC–FQC–OQC inspection, including dielectric testing, solderability checks, flying-probe testing, impedance measurement, and automated optical inspection.
We are equipped with laser measurement tools that verify routing accuracy to ±0.05 mm.
What is your maximum board size and panel capability?
We can produce single boards up to 400 mm × 750 mm, and flexible circuits sized for mobile, automotive, medical, and IoT applications. Minimum workable size is 10 mm × 15 mm, suitable for compact modules.
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