PCB Capabilities
| Items | Capabilities (Delivery area < 5m²) | Capabilities (Delivery area ≥ 5m²) | |
|---|---|---|---|
| Material | Normal FR4 | Shengyi S1141 (Not recommended for lead-free assembly process) | Shengyi S1141 (Not recommended for No-Pb assembly process) |
| Normal Tg FR4 (Halogen free) | Shengyi S1155 | Shengyi S1155 | |
| High Tg FR4 (Halogen free) | Shengyi S1165 | Shengyi S1165 | |
| HDI PCB material | LDPP (IT-180A 1037&1086)、Normal PP 106&1080 | LDPP (IT-180A 1037&1086)、Normal PP 106&1080 | |
| High CTI | Shengyi S1600 | Shengyi S1600 | |
| High Tg FR4 | FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR; IT180A、IT-150DA; N4000-13、N4000-13EP、 | IT180A、GETEK、PCL-370HR、N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI | |
| N4000-13SI、N4000-13EP SI; Megtron 4、Megtron 6 (Panasonic); EM-827 (Elite); GA-170 (Grace Electron); NP-180 (Nanya); | |||
| TU-752、TU-662 (Taiwan Union); MCL-BE-67G(H)、MCL-E-679(W)、MCL-E-679F(J) (Hitachi); VT-47 (Ventec) | |||
| Ceramic Particle Filled Laminates | Rogers4350、Rogers4003、25FR、25N | Rogers4350、Rogers4003、25FR、25N | |
| PTFE Laminates | Rogers series、Taconic series、Arlon series、Nelco series、Taizhou Wangling F4BK series、TP series; | Taconic (TLX、TLF、TLY、RF、TLC、TLG series); Arlon (Diclad、AD series) | |
| PTFE PP | Taconic TP series、TPG series、TPN series、HT1.5 (1.5mil)、Fastrise series | / | |
| Hybrid laminating | Rogers/Taconic/Arlon/Nelco laminate with FR-4 material (including partial Ro4350B hybrid laminating with FR-4) | Rogers/Taconic/Arlon/Nelco laminate with FR-4 material (including partial Ro4350B hybrid laminating with FR-4) | |
| PCB type | Rigid PCB | Backplane、HDI、High multi-layer blind & buried PCB、Embedded Capacitance、Embedded resistance board、 Heavy copper power PCB、Backdrill、Semiconductor Test products. | Backplane、HDI、High multi-layer blind & buried PCB、Backdrill |
| Buildings | Blind & buried via type | mechanical blind & buried vias with less than 3 times laminating | mechanical blind & buried vias with less than 2 times laminating |
| HDI PCB | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (n buried vias ≤ 0.3mm), Laser blind via can be filling plating | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (n buried vias ≤ 0.3mm), Laser blind via can be filling plating | |
| Finish treatment Plating/coating thickness | Lead free | Flash gold (electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、 | Flash gold (electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、 |
| Immersion silver、Immersion Tin、ENIG+OSP、ENIG+Goldfinger、Flash gold (electroplated gold)+Goldfinger、 | ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP、ENIG+Goldfinger、Flash gold (electroplated gold)+Goldfinger、 | ||
| Immersion silver+Goldfinger、Immersion Tin+Goldfinger | Immersion silver+Goldfinger、Immersion Tin+Goldfinger | ||
| Leaded | Leaded HASL | Leaded HASL | |
| Aspect ratio | 10:1 (HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG); 8:1 (OSP) | 10:1 (HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG); 8:1 (OSP) | |
| Max finished size | HASL Lead 22″39″；HASL Lead free 22″24″；Flash gold 24″24″；Hard gold 24″28″；ENIG 21″*27″； | HASL Lead 22″39″；HASL Lead free 22″24″；Flash gold 24″24″；Hard gold 24″28″；ENIG 21″*27″； | |
| Flash gold (electroplated gold) 21″48″；Immersion Tin 16″21″；Immersion silver 16″18″；OSP 24″40″； | Flash gold (electroplated gold) 21″48″；Immersion Tin 16″21″；Immersion silver 16″18″；OSP 24″40″； | ||
| Min finished size | HASL Lead 5″6″；HASL Lead free 10″10″；Flash gold 12″16″；Hard gold 3″3″； | HASL Lead 5″6″；HASL Lead free 10″10″；Flash gold 12″16″；Hard gold 3″3″； | |
| Flash gold (electroplated gold) 8″10″；Immersion Tin 2″4″；Immersion silver 2″4″；OSP 2″2″； | Flash gold (electroplated gold) 8″10″；Immersion Tin 2″4″；Immersion silver 2″4″；OSP 2″2″； | ||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm； | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm； | |
| Flash gold (electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm； | Flash gold (electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm； | ||
| Max height to goldfinger | 1.5 inch | 1.5 inch | |
| Min space between goldfingers | 6 mil | 8 mil | |
| Min block space to goldfingers | 7.5 mil | 7.5 mil | |
| Tin thickness | 2–40 μm (0.4 μm on large tin area of Leaded HASL, 1.5 μm on large tin area of HASL lead free) | 2–40 μm (0.4 μm on large tin area of Leaded HASL, 1.5 μm on large tin area of HASL lead free) | |
| OSP | 0.2–0.6 μm | 0.2–0.6 μm | |
| ENIG | Ni: 3–8 μm; Au: 0.05–0.1 μm | Ni: 3–8 μm; Au: 0.05–0.1 μm | |
| Immersion Silver | 0.2–0.4 μm | 0.2–0.4 μm | |
| Immersion Tin | ≥ 1.0 μm | ≥ 1.0 μm | |
| Hard gold | 0.1–4.0 μm | 0.1–2.0 μm | |
| Soft gold | 0.1–4.0 μm | 0.1–4.0 μm | |
| ENEPIG | Ni: 3–8 μm, Pd: 0.05–0.15 μm, Au: 0.05–0.1 μm | Ni: 3–8 μm, Pd: 0.05–0.15 μm, Au: 0.05–0.1 μm | |
| Flash gold (electroplated gold) | Ni: ≥ 3 μm; Au: 0.025–0.1 μm; base copper ≤ 1 oz | Ni: ≥ 3 μm; Au: 0.025–0.1 μm; base copper ≤ 1 oz | |
| Electroplated Goldfinger | Ni: ≥ 3 μm; Au: 0.25–1.5 μm (The thinnest point) | Ni: ≥ 3 μm; Au: 0.25–1.5 μm (The thinnest point) | |
| Carbon | 10–50 μm | 10–50 μm | |
| Soldermask | 0.4–0.7 mil (on copper area), 0.2–0.31 mil (on via pad), ≥ 0.2 mil (on circuits around the corner, just for one-time print and copper thickness < 48 μm) | 0.4–0.7 mil (on copper area), 0.2–0.31 mil (on via pad), ≥ 0.2 mil (on circuits around the corner, just for one-time print and copper thickness < 48 μm) | |
| Blue plastic | 8–31.5 mil | 8–16 mil | |
| Hole | Max thickness of mechanical hole | 31.5 mil / 59 mil / 100 mil (4 mil / 6 mil / 8 mil) | 24 mil / 47 mil / 63 mil |
| Min laser drilling size | 4 mil | 4 mil | |
| Max laser drilling size | 6 mil | 6 mil | |
| Finished mechanical hole size | 4–244 mil (corresponding drilling tool size 6–248 mil) | 5–244 mil (corresponding drilling tool size 8–248 mil) | |
| A、Min finished hole size for PTFE material and hybrid PCB is 10 mil (corresponding drilling tool size 14 mil) | A、Min finished hole size for PTFE material and hybrid PCB is 12 mil (corresponding drilling tool size 16 mil) | ||
| B、Max finished hole size for blind & buried via is 12 mil (corresponding drilling tool size 16 mil) | B、Max finished hole size for blind & buried via is 12 mil (corresponding drilling tool size 16 mil) | ||
| C、Max finished hole size for via-in-pad plugged with solder mask is 18 mil (corresponding drilling tool size 21.65 mil) | C、Max finished hole size for via-in-pad plugged with solder mask is 12 mil (corresponding drilling tool size …) | ||
| D、Min connecting hole size is 14 mil (corresponding drilling tool size is 18 mil) | D、Min connecting hole size is 14 mil (corresponding drilling tool size is 18 mil) | ||
| E、Min half-hole (PTH) size is 12 mil (corresponding drilling tool size is 16 mil) | E、Min half-hole (PTH) size is 12 mil (corresponding drilling tool size is 16 mil) | ||
| Max aspect ratio for hole plating | 20:1 (hole diameter > 8 mil) | 10:1 | |
| Max aspect ratio for laser via filling plating | 1:1 (Depth included copper thickness) | 0.9:1 (Depth included copper thickness) | |
| Max aspect ratio for mechanical depth-control drilling board (Blind hole drilling depth / blind hole size) | 1.3:1 (drilling tool size ≤ 8 mil), 1.15:1 (drilling tool size ≥ 10 mil) | 0.8:1 (drilling tool size ≥ 10 mil) | |
| Min depth of mechanical depth-control (backdrill) | 8 mil | 8 mil | |
| Min gap between hole wall and conductor (Non-blind and buried via PCB) | 5.5 mil (≤ 8L), 6.5 mil (10–14L), 7 mil (> 14L) | 7 mil (≤ 8L), 9 mil (10–14L), 10 mil (> 14L) | |
| Min gap between hole wall and conductor (Blind and buried via PCB) | 7 mil (1 time laminating), 8 mil (2 times laminating), 9 mil (3 times laminating) | 8 mil (1 time laminating), 10 mil (2 times laminating), 12 mil (3 times laminating) | |
| Min gap between hole wall and conductor (Laser blind hole buried via PCB) | 7 mil (1+N+1); 8 mil (1+1+N+1+1 or 2+N+2) | 7 mil (1+N+1); 8 mil (1+1+N+1+1 or 2+N+2) | |
| Min space between laser holes and conductor | 5 mil | 6 mil | |
| Min space between hole walls in different net | 10 mil | 10 mil | |
| Min space between hole walls in same net | 6 mil (thru-hole & laser hole PCB), 10 mil (Mechanical blind & buried PCB) | 6 mil (thru-hole & laser hole PCB), 10 mil (Mechanical blind & buried PCB) | |
| Min space between NPTH hole walls | 8 mil | 8 mil | |
| Hole location tolerance | ± 2 mil | ± 2 mil | |
| NPTH tolerance | ± 2 mil | ± 2 mil | |
| Pressfit holes tolerance | ± 2 mil | ± 2 mil | |
| Countersink depth tolerance | ± 6 mil | ± 6 mil | |
| Countersink hole size tolerance | ± 6 mil | ± 6 mil | |
| Pad (ring) | Min pad size for laser drillings | 10 mil (for 4 mil laser via), 11 mil (for 5 mil laser via) | 10 mil (for 4 mil laser via), 11 mil (for 5 mil laser via) |
| Min pad size for mechanical drillings | 16 mil (8 mil drillings) | 16 mil (8 mil drillings) | |
| Min BGA pad size | HASL: 10 mil, LF HASL: 12 mil, other surface techniques are 7 mil | HASL: 10 mil, LF HASL: 12 mil, other surface techniques are 10 mil (7 mil is ok for flash gold) | |
| Pad size tolerance (BGA) | ± 1.2 mil (pad size ≤ 12 mil); ± 10% (pad size ≥ 12 mil) | ± 1.5 mil (pad size ≤ 10 mil); ± 15% (pad size > 10 mil) | |
| Internal Layer | 1/2 OZ: 3/3 mil | 1/2 OZ: 3/3 mil | |
| 1 OZ: 3/4 mil | 1 OZ: 3/4 mil | ||
| 2 OZ: 4/5 mil | 2 OZ: 4/5.5 mil | ||
| 3 OZ: 5/8 mil | 3 OZ: 5/8 mil | ||
| 4 OZ: 6/11 mil | 4 OZ: 6/11 mil | ||
| 5 OZ: 7/13.5 mil | 5 OZ: 7/14 mil | ||
| 6 OZ: 8/15 mil | 6 OZ: 8/16 mil | ||
| 7 OZ: 9/18 mil | 7 OZ: 9/19 mil | ||
| 8 OZ: 10/21 mil | 8 OZ: 10/22 mil | ||
| 9 OZ: 11/24 mil | 9 OZ: 11/25 mil | ||
| 10 OZ: 12/27 mil | 10 OZ: 12/28 mil | ||
| External Layer | 1/3 OZ: 3/3 mil | 1/3 OZ: 3.5/4 mil | |
| 1/2 OZ: 3.5/3.5 mil | 1/2 OZ: 3.9/4.5 mil | ||
| 1 OZ: 4.5/5 mil | 1 OZ: 4.8/5.5 mil | ||
| 1.43 OZ (positive): 4.5/6 | 1.43 OZ (positive): 4.5/7 | ||
| 1.43 OZ (negative): 5/7 | 1.43 OZ (negative): 5/8 | ||
| 2 OZ: 6/7 mil | 2 OZ: 6/8 mil | ||
| 3 OZ: 6/10 mil | 3 OZ: 6/12 mil | ||
| 4 OZ: 7.5/13 mil | 4 OZ: 7.5/15 mil | ||
| 5 OZ: 9/16 mil | 5 OZ: 9/18 mil | ||
| 6 OZ: 10/19 mil | 6 OZ: 10/21 mil | ||
| 7 OZ: 11/22 mil | 7 OZ: 11/25 mil | ||
| 8 OZ: 12/26 mil | 8 OZ: 12/29 mil | ||
| 9 OZ: 13/30 mil | 9 OZ: 13/33 mil | ||
| 10 OZ: 14/35 mil | 10 OZ: 14/38 mil | ||
| Width tolerance | ≤ 10 mil: ± 1.0 mil | ≤ 10 mil: ± 20% | |
| > 10 mil: ± 1.5 mil | > 10 mil: ± 20% | ||
| Soldermask | Max drilling tool size for via filled with soldermask (single side) | 35.4 mil | 35.4 mil |
| Soldermask color | Green matte/glossy, Yellow, Black, Blue, Red, White, Purple | Green matte/glossy, Yellow, Black, Blue, Red, White, Purple | |
| Silkscreen color | White, Yellow, Black | White, Yellow, Black | |
| Max hole size for via filled with blue glue aluminium | 197 mil | 197 mil | |
| Finished hole size for via filled with resin | 4–25.4 mil | 4–25.4 mil | |
| Max aspect ratio for via filled with resin board | 12:1 | 8:1 | |
| Min width of soldermask bridge | Base copper ≤ 0.5 oz、Immersion Tin: 7.5 mil (Black), 5.5 mil (Other color), 8 mil (on copper area) | Base copper ≤ 0.5 oz、Immersion Tin: 7.5 mil (Black), 5.5 mil (Other color), 8 mil (on copper area) | |
| Base copper ≤ 0.5 oz、Finish treatment not Immersion Tin: 5.5 mil (Black, extremity 5 mil), 4 mil (Other color, extremity 3.5 mil), 8 mil (on copper area) | Base copper ≤ 0.5 oz、Finish treatment not Immersion Tin: 5.5 mil (Black, extremity 5 mil), 4 mil (Other color, extremity 3.5 mil), 8 mil (on copper area) | ||
| Base copper 1 oz: 4 mil (Green), 5 mil (Other color), 5.5 mil (Black, extremity 5 mil), 8 mil (on copper area) | Base copper 1 oz: 4 mil (Green), 5 mil (Other color), 5.5 mil (Black, extremity 5 mil), 8 mil (on copper area) | ||
| Base copper 1.43 oz: 4 mil (Green), 5.5 mil (Other color), 6 mil (Black), 8 mil (on copper area) | Base copper 1.43 oz: 4 mil (Green), 5.5 mil (Other color), 6 mil (Black), 8 mil (on copper area) | ||
| Base copper 2 oz–4 oz: 6 mil, 8 mil (on copper area) | Base copper 2 oz–4 oz: 6 mil, 8 mil (on copper area) | ||
| Routing | Min space of the V-CUT does not reveal the copper (Central line of V-CUT to internal/external circuits, H means board thickness) | H ≤ 40 mil: 12 mil (20°), 13 mil (30°), 14.6 mil (45°) | H ≤ 40 mil: 12 mil (20°), 13 mil (30°), 14.6 mil (45°) |
| 40 < H ≤ 63 mil: 14.2 mil (20°), 16 mil (30°), 20 mil (45°) | 40 < H ≤ 63 mil: 14.2 mil (20°), 16 mil (30°), 20 mil (45°) | ||
| 63 < H ≤ 94.5 mil: 16.5 mil (20°), 20 mil (30°), 25.2 mil (45°) | 63 < H ≤ 94.5 mil: 16.5 mil (20°), 20 mil (30°), 25.2 mil (45°) | ||
| 94.5 < H ≤ 118.1 mil: 18.5 mil (20°), 23.2 mil (30°), 30.3 mil (45°) | 94.5 < H ≤ 118.1 mil: 18.5 mil (20°), 23.2 mil (30°), 30.3 mil (45°) | ||
| V-CUT symmetrical tolerance | ± 4 mil | ± 4 mil | |
| Max V-CUT lines | 100 | 100 | |
| V-CUT angle tolerance | ± 5° | ± 5° | |
| V-CUT angle | 20°, 30°, 45° | 20°, 30°, 45° | |
| Gold finger bevelling | 20°, 30°, 45°, 60° | 20°, 30°, 45°, 60° | |
| Gold finger bevelling tolerance | ± 5° | ± 5° | |
| Min space of goldfinger chamfering noninterference tab | 236 mil | 275.6 mil | |
| Min gap between the side of goldfinger and the shape edge line | 8 mil | 10 mil | |
| Depth tolerance of depth-control groove milling | ± 4 mil | ± 4 mil | |
| Routing tolerance (edge to edge) | ± 4 mil | ± 4 mil | |
| Min tolerance for routing slot (PTH) | width/length tolerance ± 5 mil | width/length tolerance ± 5 mil | |
| Min tolerance for routing slot (NPTH) | width/length tolerance ± 4 mil | width/length tolerance ± 4 mil | |
| Min tolerance for drilling slot (PTH) | width tolerance ± 3 mil; Length/width ≥ 2, length tolerance ± 3 mil; Length/width < 2, length tolerance ± 4 mil | width tolerance ± 3 mil; Length/width ≥ 2, length tolerance ± 3 mil; Length/width < 2, length tolerance ± 4 mil | |
| Min tolerance for drilling slot (NPTH) | width tolerance ± 2 mil; Length/width ≥ 2, length tolerance ± 2 mil; Length/width < 2, width and length tolerance ± 3 mil | width tolerance ± 2 mil; Length/width ≥ 2, length tolerance ± 2 mil; Length/width < 2, width and length tolerance ± 3 mil | |
| Local mixed pressure | Min gap between mechanical hole wall and conductor (Local mixed pressure area) | 12 mil (local 10 mil) | 12 mil (local 10 mil) |
| Min gap between mechanical hole wall and the junction of local mixed pressure | 10 mil | 10 mil | |
| Metal-substrate PCB | Layer counts | 1–8L (Al-substrate, Cu-substrate); 2–24L (Heatsink, Sweat bonding, Buried metal); 1–2L (Ceramic-substrate) | 1–8L (Al-substrate, Cu-substrate); 2–24L (Heatsink, Sweat bonding, Buried metal); 1–2L (Ceramic-substrate) |
| PCB size (Finished) | Max: 24″24″, Min: 0.2″0.2″ (Al-substrate, Cu-substrate, Heatsink, Sweat bonding, Buried metal) | Max: 24″24″, Min: 0.2″0.2″ (Al-substrate, Cu-substrate, Heatsink, Sweat bonding, Buried metal) | |
| Max PCB size (Ceramic-substrate PCB) | 4″ * 4″ | 4″ * 4″ | |
| PCB thickness (Finished) | 0.02″–0.2″ | 0.02″–0.2″ | |
| Copper thickness (Finished) | 0.5–10 oz | 0.5–10 oz | |
| Metal thickness | 0.02″–0.2″ | 0.02″–0.2″ | |
| Metal material type | AL: 1100/1050/2124/5052/6061; Cu: c11000; Iron | AL: 1100/1050/2124/5052/6061; Cu: c11000; Iron | |
| Min finished hole size & tolerance | NPTH: 20 ± 2 mil; PTH: 40 ± 4 mil (for Al-substrate, Cu-substrate), 8 ± 4 mil (for Heatsink, Sweat bonding, Buried metal) | NPTH: 20 ± 2 mil; PTH: 40 ± 4 mil (for Al-substrate, Cu-substrate), 8 ± 4 mil (for Heatsink, Sweat bonding, Buried metal) | |
| Dimension tolerance | ± 1.2 mil | ± 2 mil | |
| PCB partial surface treatment | Leaded HASL / Lead free HASL; OSP; ENIG; ENEPIG; Plating (Ni) Soft/Hard gold; Plating Sn | Leaded HASL / Lead free HASL; OSP; ENIG; ENEPIG; Plating (Ni) Soft/Hard gold; Plating Sn | |
| Metal partial surface treatment | Cu: Plating Ni & Au; Al: Anodic oxidation, Hard anodic oxidation coating, Chemical passivation; Physical treatment: Sandblasting, Wire drawing | Cu: Plating Ni & Au; Al: Anodic oxidation, Hard anodic oxidation coating, Chemical passivation; Physical treatment: Sandblasting, Wire drawing | |
| Material | Metal PCB: Totking (T-110, T-111), Ventec (VT-4A1, VT-4A2, VT-4A3), Laird (1KA04, 1KA06); Bergquist (MP06503, HT04503), Taconic (TLY-5, TLY-5F) | Metal PCB: Totking (T-110, T-111), Ventec (VT-4A1, VT-4A2, VT-4A3), Laird (1KA04, 1KA06); Bergquist (MP06503, HT04503), Taconic (TLY-5, TLY-5F) | |
| Thermal glue thickness (dielectric layer) | 3–6 mil | 3–6 mil | |
| Buried copper block size | 0.118″ * 0.118″ – 2.756″ * 3.15″ | 0.118″ * 0.118″ – 2.756″ * 3.15″ | |
| Buried copper block drop tolerance | ± 1.6 mil | ± 1.6 mil | |
| Min gap between buried copper block and hole wall | 12 mil | 12 mil | |
| Thermal conductivity | 0.3–3 w/m·k (Heatsink, Al-substrate, Cu-substrate); 8.33 w/m·k (Sweat bonding); 0.35–3 w/m·k (Buried metal); 24–180 w/m·k (Ceramic-substrate) | 0.3–3 w/m·k (Heatsink, Al-substrate, Cu-substrate); 8.33 w/m·k (Sweat bonding); 0.35–3 w/m·k (Buried metal); 24–180 w/m·k (Ceramic-substrate) | |
| Others | Max finished copper thickness to internal & external layer | Internal layer: 10 oz; External layer: 11 oz | Internal layer: 4 oz; External layer: 5 oz |
| Finished copper thickness to external layer | base copper 1/3 oz, 0.5 oz: ≥ 35.8 μm (reference: 35.8–42.5 μm); ≥ 40.4 μm (reference: 40.4–48.5 μm) | base copper 1/3 oz, 0.5 oz: ≥ 35.8 μm (reference: 35.8–42.5 μm); ≥ 40.4 μm (reference: 40.4–48.5 μm) | |
| base copper 1 oz, 1.43 oz, 2 oz: ≥ 55.9 μm; ≥ 70 μm; ≥ 86.7 μm | base copper 1 oz, 1.43 oz, 2 oz: ≥ 55.9 μm; ≥ 70 μm; ≥ 86.7 μm | ||
| base copper 3 oz, 4 oz: ≥ 117.6 μm; ≥ 148.5 μm | base copper 3 oz, 4 oz: ≥ 117.6 μm; ≥ 148.5 μm | ||
| Layer count | 1–40L | 1–20L | |
| PCB thickness | 8–275.6 mil (No soldermask); 15.7–275.6 mil (With soldermask) | 11.8–196.85 mil (No soldermask); 15.7–196.85 mil (With soldermask) | |
| PCB thickness tolerance (Normal) | Thickness > 40 mil: ± 10%; Thickness ≤ 40 mil: ± 4 mil | Thickness > 40 mil: ± 10%; Thickness ≤ 40 mil: ± 4 mil | |
| PCB thickness tolerance (Special) | Thickness ≤ 80 mil: ± 4 mil; 80 mil < Thickness ≤ 120 mil: ± 6 mil | Thickness ≤ 80 mil: ± 10%; 80 mil < Thickness ≤ 120 mil: ± 6 mil | |
| Min finished PCB size | 0.4″ * 0.4″ | 2.0″ * 4.0″ | |
| Max finished PCB size | 23″ × 35″ (2L); 22.5″ × 33.5″ (4L); 22.5″ × 30″ (≥ 6L) | 20″ × 30″ (2L); 22.5″ × 30″ (4L); 16.5″ × 22.5″ (≥ 6L) | |
| Ionic soil | ≤ 1 μg/cm² | ≤ 1 μg/cm² | |
| Min bow & twist | 0.1% (This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry layer copper area within 10%, uniformity wiring, excluding the large area of copper and base material, haven’t plate and single panel, and the long side size ≤ 21 inch) | 0.75% | |
| Impedance tolerance | ± 5 ohm (< 50 ohm), ± 10% (≥ 50 ohm) | ± 5 ohm (< 50 ohm), ± 10% (≥ 50 ohm) | |
| Laser blind via size with filling plating | 4–5 mil (priority 4 mil) | 4–5 mil (priority 4 mil) | |
| Max aspect ratio for laser via filling plating | 1:1 (Depth included copper thickness) | 1:1 (Depth included copper thickness) |
Frequently Asked Questions
What manufacturing capabilities does your facility support?
We support full-process PCB and FPC manufacturing from prototyping to mass production, including multilayer boards (2–26 layers), HDI stack-ups (1+N+1 / 2+N+2), impedance-controlled circuits, high-temperature laminates, and ultra-fine line processing. Our equipment covers laser drilling, AOI, E-test, CNC routing, and automated surface-treatment lines to ensure efficient and stable output.
What is your minimum line width and spacing capability?
For inner layers, we achieve 3mil/3mil line width and spacing on 1/2 oz copper, and 5mil capability on 2 oz copper.
For outer layers, we support 3.2mil/3.2mil (1/2 oz) and up to 9mil for heavy-copper designs.
All fine circuits are verified using AOI and impedance tools to ensure stable production.
What drilling and via capabilities do you offer?
We provide mechanical drilling down to 0.3 mm, laser blind vias of 4–6 mil, and aspect ratio up to 12:1. Our multilayer capability supports stacked/microvias, buried vias, and staggered via structures suitable for HDI and mobile devices.
Do you support controlled impedance designs?
Yes. We offer ±10% impedance tolerance for standard 50Ω lines and ±8% for high-precision applications. Our engineering team reviews stack-ups, dielectric data, and copper roughness to ensure accurate signal performance in high-speed circuits.
What surface finishing options are available?
We provide multiple finishes including OSP, ENIG, ENEPIG, Electrolytic Nickel-Gold, and selective gold. Gold thickness ranges from 0.05–0.10 μm, and nickel thickness from 3–8 μm, suitable for wire bonding, high-frequency circuits, and long-term reliability.
How do you ensure product quality and consistency?
Every job undergoes strict IQC–IPQC–FQC–OQC inspection, including dielectric testing, solderability checks, flying-probe testing, impedance measurement, and automated optical inspection.
We are equipped with laser measurement tools that verify routing accuracy to ±0.05 mm.
What is your maximum board size and panel capability?
We can produce single boards up to 400 mm × 750 mm, and flexible circuits sized for mobile, automotive, medical, and IoT applications. Minimum workable size is 10 mm × 15 mm, suitable for compact modules.
Hello! I am JS Circuit
We deliver reliable FPC, PCB, and PCBA solutions for medical electronics—backed by responsive engineering and consistent quality.
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