Flex PCB Capabilities
| Material | FCCL (adhesive) | Shengyi SF302：PI=0.5mil，1mil，2mil； Cu=0.5oz，1oz |
| Shengyi SF305：PI=0.5mil，1mil，2mil； Cu=0.33oz，0.5oz，1oz | ||
| FCCL (adhesiveless) | Panasonic RF-775：PI=1mil，2mil，3mil； Cu=0.5oz，1oz, 2oz | |
| Taiflex PI=1mil，2mil；Cu=0.33oz，0.5oz，1oz | ||
| Dupont AP：PI=1mil，2mil，3mil，4mil； Cu=0.33oz/0.5oz/1oz/2oz | ||
| Coverlay | Shengyi SF302C：0515，0525，1025，2030 | |
| Shengyi SF305C：0515，0525，1025，2030 | ||
| Taiflex FHK：1025，1035 | ||
| Adhesive | Taiflex：AD=10um，25um，40um； | |
| Shengyi SF302B：AD=25um，40um； | ||
| PI Stiffener | Taiflex MHK：PI=3mil，5mil ，7mil，9mil； | |
| 3M | 907766779458 | |
| NO FLOW PP | / | |
| CCL | / | |
| Others | Design software | CAM350、PROTEL、PADS、POWERPCB、AUTOCAD、GENESIS、ORCAD |
| Gerber format | RS-274-D、RS-274-X | |
| Drill format | EXCELLON | |
| Layer Count | 1–10 | |
| Board thickness (without stiffener) | 0.05-0.9mm | |
| Single layer thickness tolerance (without stiffener) | ±0.03mm | |
| Single layer thickness tolerance | ±0.03mm | |
| Double layer thickness tolerance（≤0.3mm）(without stiffener) | ±0.03mm | |
| Double layer thickness tolerance（≤0.3mm） | ±0.05mm | |
| Multi layer thickness tolerance（0.3mm–0.9mm）(without stiffener) | ±10% | |
| Multi layer thickness tolerance（0.3mm–0.9mm） | ±10% | |
| Min board size | 4mm*8mm | |
| Max board size | 400*750mm | |
| Impedance tolerance | ±4Ω(≤50Ω), ±8%(＞50Ω) | |
| Stiffener registration tolerance | ±0.1mm | |
| Coverlay registration tolerance | ±3mil | |
| Min distance from coverlay open to conductor | 3mil | |
| Min coverlay bridge | 6mil | |
| Finger width tolerance | ±0.05mm | |
| Min distance finger to outline | 6mil | |
| Min. bend radius single layer | 3–6 times of board thickness | |
| Min. bend radius double- layer | 6–10 times of board thickness | |
| Min. bend radius multi- layer | 10–15 times of board thickness | |
| Min. dynamic bend radius | 20–40 times of board thickness | |
| Width of strain fillet | 1.2±0.5mm | |
| Min.test impedance | 10Ω | |
| Max.test impedance | 100MΩ | |
| Max.test current | 200mA | |
| Max.test Voltage | 500V | |
| Min size testing pad | 3mil | |
| Min distance between testing pad | 3mil | |
| Inner layer | Min. line width/spacing (12/18um copper) | 2.75mil |
| Min. line width/spacing (35um copper) | 3.5mil | |
| Min. line width/spacing (70um copper) | 5.0mil | |
| Max. copper thickness | 3oz | |
| Min distance avoid copper exposure | 8mil | |
| Outer layer | Min. line width/spacing (18um copper) | 2.75mil |
| Min. line width/spacing (35um copper) | 3.5mil | |
| Min. line width/spacing (48um copper) | 4.5mil | |
| Min. line width/spacing (70um copper) | 5.5mil | |
| Min. line width/spacing (105um copper) | 9.5mil | |
| Max. copper thickness | 5oz | |
| Min distance avoid copper exposure | 5mil | |
| Drill | Min. laser drill hole | 0.75mm |
| Min. mechanical drill hole | 0.1mm | |
| Min. distance between via and conductors | 5mil(< 4 layers) | |
| 7mil( 4–6 layers) | ||
| 10mil(7–10 layers) | ||
| Min tolerance of NPTH | ±2mil(+0，-2mil or +2mil，-0) | |
| Min distance between PTH | 10mil | |
| Solder mask &silk screen | Min solder dam (base copper <= 2 OZ) | 4mil(green), 8mil(solder dam on the large copper) |
| Min solder dam (base copper 2 OZ–4 OZ) | 6mil(green), 8mil(solder dam on the large copper) | |
| Min legend space and height (12、18um copper) | 4/23mil | |
| Min legend space and height ( 35um copper) | 5/30mil | |
| Min legend space and height ( 48um copper) | 5/30mil | |
| Min legend space and height ( 70um copper) | 6/45mil | |
| Min distance between legend and pad | 6mil | |
| Silk color | White,Yellow | |
| Surface treatment | Surface treatment | HASL,ENIG,ENEPIG,Electrolytic Nickel Gold,Immersion silver and OSP |
| Mixed surface treatment | ENIG+OSP，ENIG+G/F | |
| HASL | ≥0.13mm | |
| Gold thickness (ENIG) | 0.05-0.10um | |
| Nickel thickness(ENIG) | 3-6um | |
| Immersion silver | 0.2-0.4um | |
| OSP | 0.1-0.3um | |
| Electrolytic Nickel Gold | 0.10-4.0um | |
| Gold thickness (ENEPIG) | 0.05-0.10um | |
| Nickel thickness(ENEPIG) | 3-6um | |
| Palladium thickness (ENEPIG) | 0.05-0.15um | |
| Routing | Laser accuracy | ±0.05mm |
| Punch accuracy | ±0.10mm |
Frequently Asked Questions
What manufacturing capabilities does your facility support?
We support full-process PCB and FPC manufacturing from prototyping to mass production, including multilayer boards (2–26 layers), HDI stack-ups (1+N+1 / 2+N+2), impedance-controlled circuits, high-temperature laminates, and ultra-fine line processing. Our equipment covers laser drilling, AOI, E-test, CNC routing, and automated surface-treatment lines to ensure efficient and stable output.
What is your minimum line width and spacing capability?
For inner layers, we achieve 3mil/3mil line width and spacing on 1/2 oz copper, and 5mil capability on 2 oz copper.
For outer layers, we support 3.2mil/3.2mil (1/2 oz) and up to 9mil for heavy-copper designs.
All fine circuits are verified using AOI and impedance tools to ensure stable production.
What drilling and via capabilities do you offer?
We provide mechanical drilling down to 0.3 mm, laser blind vias of 4–6 mil, and aspect ratio up to 12:1. Our multilayer capability supports stacked/microvias, buried vias, and staggered via structures suitable for HDI and mobile devices.
Do you support controlled impedance designs?
Yes. We offer ±10% impedance tolerance for standard 50Ω lines and ±8% for high-precision applications. Our engineering team reviews stack-ups, dielectric data, and copper roughness to ensure accurate signal performance in high-speed circuits.
What surface finishing options are available?
We provide multiple finishes including OSP, ENIG, ENEPIG, Electrolytic Nickel-Gold, and selective gold. Gold thickness ranges from 0.05–0.10 μm, and nickel thickness from 3–8 μm, suitable for wire bonding, high-frequency circuits, and long-term reliability.
How do you ensure product quality and consistency?
Every job undergoes strict IQC–IPQC–FQC–OQC inspection, including dielectric testing, solderability checks, flying-probe testing, impedance measurement, and automated optical inspection.
We are equipped with laser measurement tools that verify routing accuracy to ±0.05 mm.
What is your maximum board size and panel capability?
We can produce single boards up to 400 mm × 750 mm, and flexible circuits sized for mobile, automotive, medical, and IoT applications. Minimum workable size is 10 mm × 15 mm, suitable for compact modules.
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