Rigid PCB Layer count :30L Board thickness : 3.8mm Aspect Ratio : 12 Blind vias : L29 – L30 Line Width /Space：0.075/0.05mm Min. Drill Size: 0.25/0.4mm Impedance :More than 20 impedance lines Surface Finish : ENIG |
Rigid PCB Layer count :30L Board thickness : 3.8mm Aspect Ratio : 12 Blind vias : L29 – L30 Line Width /Space：0.075/0.05mm Min. Drill Size: 0.25/0.4mm Impedance :More than 20 impedance lines Surface Finish : ENIG |
