PCB Capabilities

ItemsCapabilities(Delivery area ＜5m2)Capabilities(Delivery area ≥5m2)
MaterialNormal FR4Shengyi  S1141(Not recommend it to lead free assembly process)Shengyi  S1141(Not recommend it to No-Pb assembly process)
Normal Tg FR4(Halogen free)Shengyi S1155Shengyi S1155
High Tg FR4(Halogen free)Shengyi S1165Shengyi S1165
HDI PCB materialLDPP(IT- 180A 1037&1086)、Normal PP 106&1080LDPP(IT- 180A 1037&1086)、Normal PP 106&1080
Hight CTIShengyi S1600Shengyi S1600
High Tg FR4FR408 、FR408HR、IS410 、FR406 、GETEK、PCL-370HR;IT180A、IT- 150DA;N4000- 13、N4000- 13EP、
N4000- 13SI 、N4000- 13EP SI;Megtron 4、Megtron 6(Panasonic);EM-827(Elite);GA- 170(Grace Electron );NP-
180(Nanya);TU-752、TU-662(Taiwan Union);MCL-BE-67G(H)、MCL-E-679(W)、MCL-E-679F(J)(Hitachi);VT-
47(Ventec)		IT180A、GETEK、PCL-370HR、N4000- 13 、N4000- 13EP 、N4000- 13SI 、N4000- 13EP SI
Ceramic Particle Filled LaminatesRogers4350 、Rogers4003 、25FR、25NRogers4350 、Rogers4003 、25FR、25N
PTFE LaminatesRogers series 、Taconic series、Arlon series、Nelco series 、Taizhou Wangling F4BK series、TP series;Taconic (TLX、TLF、TLY、RF 、TLC、TLG series);Arlon(Diclad、AD series)
PTFE  PPTaconic TP series、TPG series 、TPN series 、HT1.5( 1.5mil)、Fastrise series/
Hybrid laminatingRogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid
laminating with FR-4)
PCB typeRigid pcbBackplane、HDI 、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、
Heavy copper power PCB 、Backdrill、Semiconductor Test products.		Backplane、HDI 、High multi-layer blind&buried PCB、Backdrill
BuildingsBlind&buried via typemechanical blind&burried vias with less than 3 times laminatingmechanical blind&burried vias with less than 2 times laminating
HDI PCB1+n+1, 1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating1+n+1, 1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
Finish
treatment		Lead freeFlash gold(electroplated gold)、ENIG 、Hard gold、Flash gold、HASL Lead free、OSP 、ENEPIG 、Soft gold、
Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Goldfinger,Flash gold(electroplated gold)+Gold
finger,Immersion silver+Goldfinger,Immersion Tin+Gold finge		Flash gold(electroplated gold)、ENIG 、Hard gold、Flash gold、HASL Lead free、OSP、
ENEPIG 、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Goldfinger,Flash
gold(electroplated gold)+Goldfinger,Immersion silver+Goldfinger,Immersion Tin+Gold finge
LeadedLeaded HASLLeaded HASL
aspect ratio10:1(HASL Lead free、HASL Lead、ENIG 、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)10:1(HASL Lead free、HASL Lead、ENIG 、Immersion Tin、Immersion silver、
ENEPIG);8:1(OSP)
Max finished  sizeHASL Lead 22"*39"；HASL Lead free 22"*24"；Flash gold 24"*24"；Hard gold 24"*28"；ENIG 21"*27"；Flash
gold(electroplated gold) 21"*48"；Immersion Tin 16"*21"；Immersion silver 16"*18"；OSP 24"*40"；		HASL Lead 22"*39"；HASL Lead free 22"*24"；Flash gold 24"*24"；Hard gold 24"*28"；ENIG
21"*27"；Flash gold(electroplated gold) 21"*48"；Immersion Tin 16"*21"；Immersion silver
16"*18"；OSP 24"*40"；
MIN finished  sizeHASL Lead 5"*6"；HASL Lead free 10"*10"；Flash gold 12"*16"；Hard gold 3"*3"；Flash gold(electroplated
gold) 8"*10"；Immersion Tin 2"*4"；Immersion silver 2"*4"；OSP 2"*2"；		HASL Lead 5"*6"；HASL Lead free 10"*10"；Flash gold 12"*16"；Hard gold 3"*3"；Flash
gold(electroplated gold) 8"*10"；Immersion Tin 2"*4"；Immersion silver 2"*4"；OSP 2"*2"；
PCB thicknessHASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-
7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；
OSP 0.2-6.0mm；		HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-
5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-
5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm；
MAX high to goldfinger1.5inch1.5inch
Min space between goldfingers6mil8mil
Min block space to goldfingers7.5mil7.5mil
Plating/coatin
g thickness		Tin thickness2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)
OSP0.2-0.6μm0.2-0.6μm
ENIGNi: 3-8μm; Au: 0.05-0. 1μmNi: 3-8μm; Au: 0.05-0. 1μm
Immersion Silver0.2-0.4μm0.2-0.4μm
Immersion Tin≥1.0≥1.0
Hard gold0.1-4.0μm0.1-2.0μm
Soft gold0.1-4.0μm0.1-4.0μm
ENEPIGNi: 3-8μm, Pd:0.05-0. 15μm, Au: 0.05-0. 1μmNi: 3-8μm, Pd:0.05-0. 15μm, Au: 0.05-0. 1μm
Flash gold(electroplated gold)Ni:≥3μm ; Au: 0.025-0. 1μm ;base copper≤1  ozNi:≥3μm ; Au: 0.025-0. 1μm ;base copper≤1  oz
electroplated GoldfingerNi:≥3μm ; Au: 0.25- 1.5μm(The Thinnest point)Ni:≥3μm ; Au: 0.25- 1.5μm(The Thinnest point)
Carbon10-50μm10-50μm
Soldermask0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad),≥0.2mil(on circuits around the corner, just for one-time print
and copper thickness<48um)		0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad),≥0.2mil(on circuits around the corner, just for
one-time print and copper thickness<48um)
Blue plastic8--31.5mil8-- 16mil
holeMAX thickness of mechanical hole
4mil/6mil/8mi		31.5mil/59mil/100mil24mil/47mil/63mil
Min laser drilling size4mil4mil
Max laser drilling size6mil6mil
Finshed mechanical hole size4-244mil(corresponding drilling tool size 6-248mil)5-244mil(corresponding drilling tool size 8-248mil)
A 、Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil)A 、Min finished hole size for PTFE material and hybrid PCB is 12mil(corresponding drilling tool
size 16mil)
B 、Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil)B 、Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil)
C 、Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil)                                 hole size for via-in-pad pluged with solder mask is 12mil(corresponding drilling
D 、Min connecting hole size is 14mil(corresponding drilling tool size is 18mil)D 、Min connecting hole size is 14mil(corresponding drilling tool size is 18mil)
E 、Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil)E 、Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil)
MAX aspect ratio for Hole plate20:1（hole diameter＞8mil）10:1
Max aspect ratio for laser via filling
plating		1:1(Dpeth included copper thickness)0.9:1(Dpeth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling
depth/blind hole size)		1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)0.8:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-
control(backdrill)		8mil8mil
Min gap between hole wall and
conductor (None blind and buried via
PCB)		5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L)7mil(≤8L),9mil(10-14L),10mil(＞14L)
Min gap between hole wall conductor
(Blind and buried via PCB)		7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)
Min gab between hole wall conductor
(Laser blind hole buried via PCB)		7mil（1+N+1）； 8mil（1+1+N+1+1 or 2+N+2）7mil（1+N+1）； 8mil（1+1+N+1+1 or 2+N+2）
Min space between laser holes and
conductor		5mil6mil
Min space bwteen hole walls in different
net		10mil10mil
Min space bwteen hole walls in same
net		6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls8mil8mil
Hole location tolerance±2mil±2mil
NPTH tolerance±2mil±2mil
Pressfit holes tolerance±2mil±2mil
Countersink depth tolerance±6mil±6mil
Countersink hole size tolerance±6mil±6mil
Pad(ring)Min Pad size for laser drillings10mil(for 4mil laser via),11mil(for 5mil laser via10mil(for 4mil laser via),11mil(for 5mil laser via
Min Pad size for mechanical drillings16mil(8mil drillings16mil(8mil drillings)
Min BGA pad sizeHASL:10mil, LF HASL:12mil, other surface technics are 7miHASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold
Pad size tolerance(BGA)±1.2mil(pad size≤12mil);±10%(pad size≥12mil)±1.5mil(pad size≤10mil);±15%(pad size>10mil)

Internal Layer1/2OZ：3/3mil1/2OZ：  3/3mil
1OZ:   3/4mil1OZ:    3/4mil
2OZ:   4/5mil2OZ:    4/5.5mil
3OZ:   5/8mil3OZ:    5/8mil
4OZ:   6/11mil4OZ:    6/11mil
5OZ:   7/13.5mil5OZ:    7/14mil
6OZ:   8/15mil6OZ:    8/16mil
7OZ:   9/18mil7OZ:    9/19mil
8OZ:    10/21mil8OZ:     10/22mil
9OZ:    11/24mil9OZ:     11/25mil
10OZ:  12/27mil10OZ:    12/28mil

External Layer1/3OZ：3/3mil1/3OZ：3.5/4mil
1/2OZ：3.5/3.5mil1/2OZ：3.9/4.5mil
1OZ:   4.5/5mil1OZ:   4.8/5.5mil
1.43OZ（positive） :4.5/61.43OZ（positive） :4.5/7
1.43OZ（negative ）:5/71.43OZ（negative ）:5/8
2OZ:   6/7mil2OZ:   6/8mil
3OZ:   6/10mil3OZ:   6/12mil
4OZ:   7.5/13mil4OZ:   7.5/15mil
5OZ:   9/16mil5OZ:   9/18mil
6OZ:    10/19mil6OZ:    10/21mil
7OZ:    11/22mil7OZ:    11/25mil
8OZ:    12/26mil8OZ:    12/29mil
9OZ:    13/30mil9OZ:    13/33mil
10OZ:  14/35mil10OZ:  14/38mil
Width tolerance≤10mil：+/-1.0mil≤10mil：+/-20%
>10mil：+/-1.5mil>10mil：+/-20%
SoldermaskMAX drilling tool size  for via filled
with Soldermask  (single side)		35.4mil35.4mil
Soldermask colorGreen matte/glossy, Yellow, Black, Blue, Red, White, PurpleGreen matte/glossy, Yellow, Black, Blue, Red, White, Purple
Silkscreen colorWhite, Yellow, BlackWhite, Yellow,Black
MAX hole size for via filled with Blue
glue aluminium		197mil197mil
Finish hole size for via filled with resin4-25.4mil4-25.4mil
Max aspect ratio for via filled with resin
board		12:18:1
Min width of soldermask bridgeBase copper≤0.5 oz 、Immersion Tin：  7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)Base copper≤0.5 oz 、Immersion Tin：  7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz 、Finish treatment not Immersion Tin：  5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area)		Base copper≤0.5 oz 、Finish treatment not Immersion Tin：  5.5 mil(Black,extremity 5mil),
4mil(Other color,extremity 3.5mil) , 8mil( on copper area)
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper
area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper areaBase copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
RoutingMin space of the V-CUT does not
reveal the copper ( Central Line of v-cut
to internal/external circuits,H means
board thickness)		H≤40mil:  12mil(20°mean V-CUT angle),13mil(30°),14.6mil(45°H≤40mil:  12mil(20°mean V-CUT angle),13mil(30°),14.6mil(45°
40<H≤63mil:    14.2mil(20°),16mil(30°),20mil(45°40<H≤63mil:    14.2mil(20°),16mil(30°),20mil(45°
63<H≤94.5mil:  16.5mil(20°), 20mil(30°),25.2mil(45°63<H≤94.5mil:  16.5mil(20°), 20mil(30°),25.2mil(45°)
94.5<H≤118.1mil:  18.5mil(20°),23.2mil(30°),30.3(45°)94.5<H≤118.1mil:  18.5mil(20°),23.2mil(30°),30.3(45°)
V-CUT  symmetrical tolerance±4mil±4mil
MAX V-CUT lines100100
V-CUT angle tolerance±5°±5°
V-CUT angle20 、30 、45°20 、30 、45°
Gold finger bevelling20 、30 、45 、60°20 、30 、45 、60°
Gold finger bevelling tolerance±5°±5°
Min space of goldfinger chamfering
noninterference tab		236mil275.6mil
Min gap between the side of
goldfinger and the shape edge line		8mil10mil
Depth tolerance of depth-control groove
milling		±4mil±4mil
routing tolerance (edge to edge)±4mil±4mil
Min tolerance for routing slot（PTH）width/length tolerance ±5milwidth/length tolerance  ±5mil
Min tolerance for routing slot
（NPTH）		width/length  tolerance ±4milwidth/length tolerance ±4mil
Min tolerance for drilling slot（PTH）width  tolerance  ±3mil；Length/width≥2,length tolerance  ±3mil;  Length/width＜2,length tolerance  ±4milwidth  tolerance  ±3mil；Length/width≥2,length tolerance  ±3mil;  Length/width＜2, length
tolerance  ±4mil
Min tolerance for drilling slot
（NPTH）		width  tolerance  ±2mil；Length/width≥2, length tolerance is±2mil;  Length/width＜2,width and length tolerance  ±
3mil		width  tolerance  ±2mil；Length/width≥2, length tolerance is±2mil;  Length/width＜2,width and
length tolerance  ±3mil
Local mixed
pressure		Min gap between mechanical hole wall
and conductor (Local mixed pressure
area)		12mil(local 10mil)12mil(local 10mil)
Min gap between mechanical hole wall
and  the junction of local mixed pressure		10mil10mil
Metal-
substrate PCB		Layer counts1-8L(Al-substrate、Cu-substrate);2-24L(Heatsink、Sweat bonding、Buried metal);1-2L(Ceramic-substrate)1-8L(Al-substrate、Cu-substrate);2-24L(Heatsink、Sweat bonding、Buried metal);1-2L(Ceramic-
substrate)
PCB size (Finished)Max: 24"*24",  Min: 0.2"*0.2" (Al-substrate、Cu-substrate 、Heatsink、Sweat bonding、Buried metal)Max: 24"*24",  Min: 0.2"*0.2" (Al-substrate、Cu-substrate 、Heatsink、Sweat bonding、Buried
metal)
MAX PCB size(Ceramic-substrate
PCB)		4" * 4"4" * 4"
PCB thickness(Finished)0.02"-0.2"0.02"-0.2"
Copper thickness(Finished)0.5-10  oz0.5-10  oz
Metal thickness0.02"-0.2"0.02"-0.2"
Metal material typeAL:1100/1050/2124/5052/6061;Cu:c11000; IronAL:1100/1050/2124/5052/6061;Cu:c11000; Iron
Min finished hole size&toleranceNPTH: 20±2mil; PTH: 40±4mil(for Al-substrate、Cu-substrate)、8±4mil(for Heatsink、Sweat bonding、Buried
metal)		NPTH: 20±2mil; PTH: 40±4mil(for Al-substrate、Cu-substrate)、8±4mil(for Heatsink、Sweat
bonding、Buried metal)
Dimension tolerance±1.2mil±2mil
PCB partial surface treatmentLeaded HASL/Lead free HASL; OSP;  ENIG;  ENEPIG ; Plating(Ni)Soft/Hard gold;Plating SnLeaded HASL/Lead free HASL; OSP;  ENIG;  ENEPIG ; Plating(Ni)Soft/Hard gold;Plating Sn
Metal partial surface treatmentCu:Plating Ni&Au ; Al:Anodic oxidation、Hard anodic oxidation coating、Chemical passivation; Physical
treatment:Sandblasting、Wire drawing		Cu:Plating Ni&Au ; Al:Anodic oxidation、Hard anodic oxidation coating、Chemical passivation;
Physical treatment:Sandblasting、Wire drawing
MaterialMetal PCB:Totking(T-110、T-111) 、Ventec(VT-4A1、VT-4A2、VT-4A3)、Laird(1KA04、
1KA06);Bergquist(MP06503、HT04503)、TACONIC(TLY-5、TLY-5F)		Metal PCB:Totking(T-110、T-111) 、Ventec(VT-4A1、VT-4A2、VT-4A3)、Laird(1KA04、
1KA06);Bergquist(MP06503、HT04503)、TACONIC(TLY-5、TLY-5F)
Thermal glue thickness (dielectric layer)3-6mil3-6mil
Buried copper block size0.118" * 0.118" -- 2.756" * 3.15"0.118"*0.118" -- 2.756"*3.15"
Buried copper block drop tolerance±1.6mil±1.6mil
Min gap between Buried copper block
and hole wall		12mil12mil
Thermal conductivity0.3-3w/m.k(Heatsink、Al-substrate、Cu-substrate);8.33w/m.k(Sweat bonding);0.35-3w/m.k(Buried metal);24-180
w/m.k(Ceramic-substrate)		0.3-3w/m.k(Heatsink、Al-substrate、Cu-substrate);8.33w/m.k(Sweat bonding);0.35-3w/m.k(Buried
metal);24-180 w/m.k(Ceramic-substrate)
OthersMax finished copper thickness to
internal&external layer		Internal layer:10 oz; External layer:11 ozInternal layer:4oz; External layer:5 oz
finished copper thickness to external
layer		base copper 1/3 oz 、0.5 oz ：≥35.8μm（reference value：35.8-42.5μm）；≥40.4μm（reference value：40.4-
48.5μm）		base copper 1/3 oz 、0.5 oz ：≥35.8μm（reference value：35.8-42.5μm）；≥40.4μm（reference
value：40.4-48.5μm）
base copper 1 oz 、 1.43 oz 、2 oz ：≥55.9μm；≥70μm；≥86.7μmbase copper 1 oz 、 1.43 oz 、2 oz ：≥55.9μm；≥70μm；≥86.7μm
base copper 3oz 、4 oz ：≥117.6μm；≥148.5μmbase copper 3oz 、4 oz ：≥117.6μm；≥148.5μm
Layer count1-40L1-20L
PCB thickness8 - 275.6mil(No Soldermask);15.7-275.6mil(Have Soldermask)11.8-196.85mil(No Soldermask);15.7-196.85mil(Have Soldermask)
PCB thickness tolerance（Normal
)		Thickness＞40mil: ±10% ；Thickness≤40mil: ±4milThickness＞40mil: ±10% ；Thickness≤40mil: ±4mil
PCB thickness tolerance（Special ）Thickness≤80mil: ±4mil ；80mil＜Thickness≤120mil: ±6milThickness≤80mil: ±10% ；80mil＜Thickness≤120mil: ±6mil
Min finished PCB size0.4" * 0.4"2.0" * 4.0"
Max finished PCB size23×35 inch(2L)  ;  22.5*33.5 inch(4L)；22.5*30inch(≥6L）20×30 inch(2L)  ;  22.5*30 inch(4L)； 16.5*22.5inch(≥6L）
ionic soil≤1ug/cm2≤1ug/cm2
Min bow&twist0.1%(This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry
layer Copper area  within 10%, uniformity wiring , excluding the large area of copper and base material,haven't plat
and single panel, and the long side size≤ 21 inch)		e0.75%
Impedance tolerance±5ohm(＜50ohm),  ±10%(≥50ohm)±5ohm(<50ohm),±10%(≥50ohm)
Laser blind via size with filling plating4-5mil(priority 4mil)4-5mil(priority 4mil)
Max aspect ratio for laser via filling
plating		1:1(Depth included copper thickness)1:1(Depth included copper thickness)