Rigid-Flex Capabilities
| Material | FCCL (adhesive) | Shengyi SF302：PI=0.5mil，1mil，2mil；Cu=0.5oz，1oz |
| Shengyi SF305：PI=0.5mil，1mil，2mil；Cu=0.33oz，0.5oz，1oz | ||
| FCCL (adhesiveless) | Panasonic RF-775：PI=1mil，2mil，3mil；Cu=0.5oz，1oz, 2oz | |
| Dupont AP：PI=1mil，2mil，3mil，4mil； Cu=0.33oz/0.5oz/1oz/2oz | ||
| Coverlay | Shengyi SF302C：0515，0525，1025，2030 | |
| Shengyi SF305C：0515，0525，1025，2030 | ||
| Taiflex FHK：1025，1035 | ||
| Adhesive | Taiflex：AD=10um，25um，40um； | |
| Shengyi SF302B：AD=25um，40um； | ||
| PI Stiffener | Taiflex MHK：PI=3mil，5mil ，7mil，9mil； | |
| 3M | 9077，6677，9458 | |
| NO FLOW PP | Ventec:VT‐47N; Ventec:VT‐901 | |
| CCL | ITEQ: IT‐180A; Shengyi: S1000‐2;Arlon: 85N; Rogers: RO4000 serie | |
| Others | Design software | CAM350、PROTEL、PADS、POWERPCB、AUTOCAD、GENESIS、ORCAD |
| Gerber format | RS-274-D、RS-274-X | |
| Drill format | EXCELLON | |
| Layer Count | 2--26 | |
| Board thickness | 0.3-4.0mm | |
| Board thickness tolerance（＞1.0mm） | ±10% | |
| Board thickness tolerance(≤1.0mm） | ±0.1mm | |
| Min board size | 10mm*15mm | |
| Max board size | 400*750mm | |
| Impedance tolerance | ±4Ω(≤50Ω), ±8%(＞50Ω) | |
| HDI | N+2+N | |
| Warpage (%) | 0.75 | |
| Width of strain fillet | 1.2±0.5mm | |
| Min.test impedance | 10Ω | |
| Max.test impedance | 100MΩ | |
| Max.test current | 200mA | |
| Max.test Voltage | 500V | |
| Min size testing pad | 3mil | |
| Min distance between testing pad | 3mil | |
| Inner layer | Min. line width/spacing (12/18um copper) | 3mil |
| Min. line width/spacing (35um copper) | 3.5mil | |
| Min. line width/spacing (70um copper) | 5.0mil | |
| Max. copper thickness | 3oz | |
| Min distance avoid copper exposure | 8mil | |
| Outer layer | Min. line width/spacing (18um copper) | 3.2mil |
| Min. line width/spacing (35um copper) | 3.5mil | |
| Min. line width/spacing (48um copper) | 4.8mil | |
| Min. line width/spacing (70um copper) | 6.0mil | |
| Min. line width/spacing (105um copper) | 9.0mil | |
| Max. copper thickness | 5oz | |
| Min distance avoid copper exposure | 8mil | |
| Drill | Min metal hole | 0.3mm |
| Max. aspect ratio | 12:01 | |
| Min. distance between PTH and conductors | 5mil(< 5 layers) | |
| 7mil( 6--11 layers) | ||
| 10mil(12--18 layers) | ||
| 10mil(>18 layers) | ||
| laser blind hole | 4--6mil | |
| Max bury hole | 0.4mm | |
| Min tolerance of NPTH | ±2mil(+0，-2mil or +2mil，-0) | |
| Solder mask&silk screen | Min solder dam (base copper <= 2 OZ) | 4mil(green), 8mil(solder dam on the large copper) |
| Min solder dam (base copper 2 OZ--4 OZ) | 6mil(green), 8mil(solder dam on the large copper) | |
| Min legend space and height (12、18um copper) | 4/23mil | |
| Min legend space and height ( 35um copper) | 5/30mil | |
| Min legend space and height ( 48um copper) | 5/30mil | |
| Min legend space and height ( 70um copper) | 6/45mil | |
| Min distance between legend and pad | 6mil | |
| Silk color | White,Yellow,Black | |
| Surface treatment | Surface treatment | HASL,ENIG,ENEPIG,Electrolytic Nickel Gold,Immersion silver ,OSP and Electrolytic Copper Gold Nickel) |
| Mixed surface treatment | ENIG+OSP，ENIG+G/F,Electrolytic Gold+G/F | |
| HASL | ≥0.2mm | |
| Gold thickness (ENIG) | 0.05-0.10um | |
| Nickel thickness(ENIG) | 3-8um | |
| Immersion silver | 0.2-0.4um | |
| OSP | 0.1-0.3um | |
| Electrolytic Nickel Gold | 0.10-4.0um | |
| Gold thickness (ENEPIG) | 0.05-0.10um | |
| Nickel thickness(ENEPIG) | 3-8um | |
| Palladium thickness (ENEPIG) | 0.05-0.15um | |
| Gold thickness(Electrolytic Copper Gold Nickel) | 0.025-0.10um | |
| Nickel thickness(Electrolytic Copper Gold Nickel) | ≥3um | |
| Routing | Laser accuracy | ±0.05mm |
| Punch accuracy | ±0.10mm |