Flex PCB Capabilities
| Material | FCCL (adhesive) | Shengyi SF302：PI=0.5mil，1mil，2mil； Cu=0.5oz，1oz |
| Shengyi SF305：PI=0.5mil，1mil，2mil； Cu=0.33oz，0.5oz，1oz | ||
| FCCL (adhesiveless) | Panasonic RF-775：PI=1mil，2mil，3mil； Cu=0.5oz，1oz, 2oz | |
| Taiflex PI=1mil，2mil；Cu=0.33oz，0.5oz，1oz | ||
| Dupont AP：PI=1mil，2mil，3mil，4mil； Cu=0.33oz/0.5oz/1oz/2oz | ||
| Coverlay | Shengyi SF302C：0515，0525，1025，2030 | |
| Shengyi SF305C：0515，0525，1025，2030 | ||
| Taiflex FHK：1025，1035 | ||
| Adhesive | Taiflex：AD=10um，25um，40um； | |
| Shengyi SF302B：AD=25um，40um； | ||
| PI Stiffener | Taiflex MHK：PI=3mil，5mil ，7mil，9mil； | |
| 3M | 9077，6677，9458 | |
| NO FLOW PP | / | |
| CCL | / | |
| Others | Design software | CAM350、PROTEL、PADS、POWERPCB、AUTOCAD、GENESIS、ORCAD |
| Gerber format | RS-274-D、RS-274-X | |
| Drill format | EXCELLON | |
| Layer Count | 1--10 | |
| Board thickness (without stiffener) | 0.05-0.9mm | |
| Single layer thickness tolerance (without stiffener) | ±0.03mm | |
| Single layer thickness tolerance | ±0.03mm | |
| Double layer thickness tolerance（≤0.3mm）(without stiffener) | ±0.03mm | |
| Double layer thickness tolerance（≤0.3mm） | ±0.05mm | |
| Multi layer thickness tolerance（0.3mm--0.9mm）(without stiffener) | ±10% | |
| Multi layer thickness tolerance（0.3mm--0.9mm） | ±10% | |
| Min board size | 4mm*8mm | |
| Max board size | 400*750mm | |
| Impedance tolerance | ±4Ω(≤50Ω), ±8%(＞50Ω) | |
| Stiffener registration tolerance | ±0.1mm | |
| Coverlay registration tolerance | ±3mil | |
| Min distance from coverlay open to conductor | 3mil | |
| Min coverlay bridge | 6mil | |
| Finger width tolerance | ±0.05mm | |
| Min distance finger to outline | 6mil | |
| Min. bend radius single layer | 3--6 times of board thickness | |
| Min. bend radius double- layer | 6--10 times of board thickness | |
| Min. bend radius multi- layer | 10--15 times of board thickness | |
| Min. dynamic bend radius | 20--40 times of board thickness | |
| Width of strain fillet | 1.2±0.5mm | |
| Min.test impedance | 10Ω | |
| Max.test impedance | 100MΩ | |
| Max.test current | 200mA | |
| Max.test Voltage | 500V | |
| Min size testing pad | 3mil | |
| Min distance between testing pad | 3mil | |
| Inner layer | Min. line width/spacing (12/18um copper) | 2.75mil |
| Min. line width/spacing (35um copper) | 3.5mil | |
| Min. line width/spacing (70um copper) | 5.0mil | |
| Max. copper thickness | 3oz | |
| Min distance avoid copper exposure | 8mil | |
| Outer layer | Min. line width/spacing (18um copper) | 2.75mil |
| Min. line width/spacing (35um copper) | 3.5mil | |
| Min. line width/spacing (48um copper) | 4.5mil | |
| Min. line width/spacing (70um copper) | 5.5mil | |
| Min. line width/spacing (105um copper) | 9.5mil | |
| Max. copper thickness | 5oz | |
| Min distance avoid copper exposure | 5mil | |
| Drill | Min. laser drill hole | 0.75mm |
| Min. mechanical drill hole | 0.1mm | |
| Min. distance between via and conductors | 5mil(< 4 layers) | |
| 7mil( 4--6 layers) | ||
| 10mil(7--10 layers) | ||
| Min tolerance of NPTH | ±2mil(+0，-2mil or +2mil，-0) | |
| Min distance between PTH | 10mil | |
| Solder mask &silk screen | Min solder dam (base copper <= 2 OZ) | 4mil(green), 8mil(solder dam on the large copper) |
| Min solder dam (base copper 2 OZ--4 OZ) | 6mil(green), 8mil(solder dam on the large copper) | |
| Min legend space and height (12、18um copper) | 4/23mil | |
| Min legend space and height ( 35um copper) | 5/30mil | |
| Min legend space and height ( 48um copper) | 5/30mil | |
| Min legend space and height ( 70um copper) | 6/45mil | |
| Min distance between legend and pad | 6mil | |
| Silk color | White,Yellow | |
| Surface treatment | Surface treatment | HASL,ENIG,ENEPIG,Electrolytic Nickel Gold,Immersion silver and OSP |
| Mixed surface treatment | ENIG+OSP，ENIG+G/F | |
| HASL | ≥0.13mm | |
| Gold thickness (ENIG) | 0.05-0.10um | |
| Nickel thickness(ENIG) | 3-6um | |
| Immersion silver | 0.2-0.4um | |
| OSP | 0.1-0.3um | |
| Electrolytic Nickel Gold | 0.10-4.0um | |
| Gold thickness (ENEPIG) | 0.05-0.10um | |
| Nickel thickness(ENEPIG) | 3-6um | |
| Palladium thickness (ENEPIG) | 0.05-0.15um | |
| Routing | Laser accuracy | ±0.05mm |
| Punch accuracy | ±0.10mm |