Flex PCB Capabilities

Material FCCL (adhesive) Shengyi SF302：PI=0.5mil，1mil，2mil；         Cu=0.5oz，1oz
Shengyi SF305：PI=0.5mil，1mil，2mil；          Cu=0.33oz，0.5oz，1oz
FCCL (adhesiveless) Panasonic RF-775：PI=1mil，2mil，3mil；         Cu=0.5oz，1oz, 2oz
Taiflex PI=1mil，2mil；Cu=0.33oz，0.5oz，1oz
Dupont AP：PI=1mil，2mil，3mil，4mil；       Cu=0.33oz/0.5oz/1oz/2oz
Coverlay Shengyi SF302C：0515，0525，1025，2030
Shengyi SF305C：0515，0525，1025，2030
Taiflex FHK：1025，1035
Adhesive Taiflex：AD=10um，25um，40um；
Shengyi  SF302B：AD=25um，40um；
PI Stiffener Taiflex MHK：PI=3mil，5mil ，7mil，9mil；
3M 9077，6677，9458
NO FLOW PP /
CCL /
Others  Design software CAM350、PROTEL、PADS、POWERPCB、AUTOCAD、GENESIS、ORCAD
Gerber format RS-274-D、RS-274-X
Drill format EXCELLON 
Layer Count  1--10
Board thickness (without stiffener) 0.05-0.9mm
Single layer thickness tolerance (without stiffener) ±0.03mm
Single layer thickness tolerance ±0.03mm
Double layer thickness tolerance（≤0.3mm）(without stiffener) ±0.03mm
Double layer thickness tolerance（≤0.3mm） ±0.05mm
Multi layer thickness tolerance（0.3mm--0.9mm）(without stiffener) ±10%
Multi layer thickness tolerance（0.3mm--0.9mm） ±10%
Min board size 4mm*8mm
Max board size 400*750mm
Impedance tolerance ±4Ω(≤50Ω),     ±8%(＞50Ω)
Stiffener registration tolerance  ±0.1mm
Coverlay registration tolerance  ±3mil
Min distance from coverlay open to conductor 3mil
Min coverlay bridge  6mil
Finger width tolerance ±0.05mm
Min distance finger to outline  6mil
Min. bend radius single layer 3--6 times of board thickness
Min. bend radius double- layer 6--10 times of board thickness
Min. bend radius multi- layer 10--15 times of board thickness
Min. dynamic bend radius  20--40 times of board thickness
Width of strain fillet 1.2±0.5mm
Min.test impedance 10Ω
Max.test impedance 100MΩ
Max.test current 200mA
Max.test Voltage 500V
Min size testing pad  3mil
Min distance between testing pad 3mil
Inner layer Min.  line width/spacing (12/18um copper) 2.75mil
Min.  line width/spacing (35um copper) 3.5mil
Min.  line width/spacing (70um copper) 5.0mil
Max. copper thickness 3oz
Min distance avoid copper exposure  8mil
Outer layer Min.  line width/spacing (18um copper) 2.75mil
Min.  line width/spacing (35um copper) 3.5mil
Min.  line width/spacing (48um copper) 4.5mil
Min.  line width/spacing (70um copper) 5.5mil
Min.  line width/spacing (105um copper) 9.5mil
Max. copper thickness 5oz
Min distance avoid copper exposure  5mil
 Drill Min. laser drill hole 0.75mm
Min. mechanical drill hole 0.1mm
Min. distance between via and conductors 5mil(< 4 layers)
7mil( 4--6 layers)
10mil(7--10 layers)
Min tolerance of  NPTH  ±2mil(+0，-2mil or +2mil，-0)
Min distance between PTH 10mil
Solder mask  &silk screen Min solder dam (base copper <= 2 OZ) 4mil(green), 8mil(solder dam on the large copper)
Min solder dam (base copper  2 OZ--4 OZ) 6mil(green), 8mil(solder dam on the large copper)
Min legend space and height (12、18um copper) 4/23mil
Min legend space and height ( 35um copper) 5/30mil
Min legend space and height ( 48um copper) 5/30mil
Min legend space and height ( 70um copper) 6/45mil
Min distance between legend and pad  6mil
Silk color White,Yellow
Surface treatment Surface treatment HASL,ENIG,ENEPIG,Electrolytic Nickel Gold,Immersion silver and OSP
Mixed surface treatment ENIG+OSP，ENIG+G/F
HASL ≥0.13mm
Gold thickness (ENIG) 0.05-0.10um
Nickel thickness(ENIG) 3-6um
Immersion silver 0.2-0.4um
OSP 0.1-0.3um
Electrolytic Nickel Gold 0.10-4.0um
Gold thickness (ENEPIG) 0.05-0.10um
Nickel thickness(ENEPIG) 3-6um
Palladium thickness (ENEPIG) 0.05-0.15um
Routing Laser accuracy ±0.05mm
Punch accuracy ±0.10mm